
PDC
X7R dielectric provides ±15% capacitance stability over -55°C to +125°C, suitable for automotive, industrial, and other applications requiring a wider operating temperature range. The 2211 low-ESL reverse-geometry package minimizes equivalent series inductance by orienting terminals along the long edge, making it essential for high-speed CPU/GPU core power decoupling, 5G base station PA bias, and AI accelerator boards. Commonly used in Telecom Equipment, Server / Data Center, AI Accelerator. Typical end-products include 5G PA Power Decoupling, CPU/GPU Core Power, Data Center Server Board.
| RoHS | Yes |
| 用途 | safety standard |
| サイズ | 2211 |
| 静電容量 | 1.5NF |
| 温度特性 | X7R |
| 電圧 | Y2 |
| 許容差 | ±10% |
| 説明 | 2211 X7R Y2 1.5NF ±10% |